Crystalbond™ and Wafer-Mount™ adhesives are ideal materials for temporarily mounting products that require dicing, polishing, and other machining processes.
These adhesives exhibit high bond strength and adhere readily to metals, glass and ceramics. When processing is complete, reheating and cleaning with one of Aremco’s environmentally friendly cleaning agents removes these adhesives.
Machining advanced ceramics
Lapping and polishing optical components
Dicing ceramic substrates and semiconductor wafers
Dicing ferrites, glasses and piezoelectrics
Dicing metal and optical single crystals
Mounting cross-sections for electron microscopy
Backfilling components for temporary mechanical support
Dry plasma etching.