Aremco Crystalbond™ 555-HMP Mounting Stick
Crystalbond™ 555-HMP Mid-range melting point of 150 ºF (66 ºC)
Use 555-HMP for low stress machining processes, dry plasma etching or silicon wafers, de-paneling copper plated Teflon boards, and dicing ceramic green tape. Transparent in thin cross-sections and soluble in hot water.
Quantity: One stick (rectangular bar ⅝” × 1” × 7”)
- Machining advanced ceramics
- Lapping and polishing optical components
- Dicing ceramic substrates
- Dicing semiconductor wafers
- Dicing ferrites, glasses and piezoelectrics
- Dicing metal and optical single crystals
- Mounting cross-sections for SEM
- Backfilling components for support
- Dry plasma etching.
UK delivery included
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