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Precision Diamond Cut-Off Saw

Precision Diamond Cut-Off Saw including:

  • 6" Diamond Blade
  • Dressing Stick
  • Coolant
  • Vice (Adjustable Guide)
  • Plexiglass Cover
  • Flanges for Blade 

This precision sectioning saw is designed for fast & precision sectioning of PCB Boards, ceramic substrates, electronic packages, copper lead frames, silicon wafers, optical glass, ferrite chunks and many other materials. Coolant is stored below and applied to sample by rotating the blade. Saw table has a large working area measuring 15" x 9". The durable housing is made from unbreakable cross linked polyethylene which cannot rust.  This unit is equipped with a heavy duty direct drive permanent magnet 1/4 Hp motor with sealed ball bearing. RPM’s range from 400 to 3,400, allowing for most samples/materials to be sectioned in just few seconds/minutes, with minimum material structure deformation. 

  • Variable Speed from 400 to 3,400 RPM; Allows operator to easily change speeds during operation. Even most delicate samples can be sectioned without deformation
  • Removable Cutting Table for easy coolant & blade changes  
  • Adjustable blade guard accepts 4", 5", and 6" Blades  
  • Largest Working Surface area of saw in its class. 15" x 9" for sectioning oversize samples
  • Powerful 1/4 Hp motor
  • Designed for cutting ultra hard to soft specimens / materials
  • Unbreakable cross-linked polyethylene prevents corrosion
  • Minimal blade load
  • Largest surface work area available
  • Very easy to use & maintain
  • Universal Application / Adjusts to fit almost any application

 

Specifications:

  • Cutting Action: Linear blade feeds into work piece. Material is slowly feed into the rotating blade.
  • Motor Power: 1/4 HP 
  • RPMs (Variable Speed) 400-3,000 RPM
  • Coolant Capacity: 1/4 
  • Arbor: 1/2" (12.7mm)
  • Slot for blade: 0.124" (3.15mm)
  • Arbor Size Diameter: 1.0"  
  • Dimensions: 18" x 18" x 12"
  • 220V / 50Hz
  • Made in U.S.A. / CE Marked

 

  • Blades can accommodate:
  • Wafering Blade Diameters: 4 to 6 (100mm to 150mm)
  • Abrasive Blade Diameters: 4 to 6 (100mm to 150mm)
  • Blade Thickness: .006 to .075

Can be used with: 

• SMART CUT Diamond Wafering Blades 

• Other manufacturers 

• Diamond Wafering Blades 

• Abrasive Cut Off blades

Price includes UK delivery

All images shown are for illustration purposes only. Actual product may vary

Product Code: LABEQ-SAWW-0001W
£1,250.00

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