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Silicon Wafers

Silicon Wafers

We distribute Silicon wafers throughout Europe. The services and specifications we offer are listed below, providing full cassettes (25 wafers) or part boxes.

l We produce wafers to customer specifications - please contact us for a quote

l We stock standard wafer lines through our webshop - review our range here

l We offer wafer storage solutions - review our Wafer & Substrate Storage range here

 
Grades
 

Prime

Test

Reclaim

Mechanical

 
 
Diameter & Thickness
 

Size

Standard Thickness (µm)

Tolerance (+/- µm)

1” (25.4mm)

250

15

2” (50.8mm)

275

25

3” (76.2mm)

380

25

4” (100mm)

525

20

5” (125mm)

625

20

6” (150mm)

675

20

8” (200mm)

725

25

Specialist thin wafers available: 1” down to 10 µm thick / 4” down to 90 µm thick / 6” down to 150µm thick

Custom thicknesses available on request

 

Type & Dopant

 

Type

Dopant

Intrinsic

-

n-type

P- Phosphorous, Sb - Antimony, As - Arsenic

p-type

B - Boron

Heavy P or B doping is also available

 

Resistivity

 

Crystal Growth Method

From

To

Czochralski (CZ)

1 milliohm-cm

150 ohm-cm

Float Zone (FZ)

-

Up to 10,000 ohm-cm

 

Orientation

 

Orientation

Tolerance

<100>

Standard +/- 0.5º & Custom up to +/- 0.05º

<110>

<111>

Custom Orientations & Off Orientations (up to 40º) available on request

 

Surface

 

Surface

As cut

Lapped

Etched

Single Side Polished

Double Side Polished

 On polished surface: Roughness <2Å / Total Thickness Variation (TTV) <1µm

 

Laser marking available on request

 

 

Silicon as a Substrate

 

Type

Specifications

Windows

As per customer drawings

Components

As per customer drawings

Blocks

To customer specification including surface roughness/flatness

We can also supply Germanium single crystal components

 

Platinised Wafers

 

 

Specifications

Diameter

4” Standard or other sizes available upon request

Layers

Thermal SiO2, TiO2 or Ti Adhesion, Platinum E-Beam

 

Silicon on Insulator (SOI) Wafers

 

Specifications

Size

As per customer specification

Layers

Handle, Device, Buried Oxide (BOX) - All layers as per customer specification

 

SERVICES

Coatings

 

Type

Method

Thickness (nm)

Diameter

SiO2 Silicon Dioxide

Wet Oxidation

200-3000

From 1” to 6”

High Purity Dry Oxidation

20-300

From 1” to 6”

Single face oxidation also available

Si3N4 Silicon Nitride

LPCVD or PECVD

20-500

From 2” to 6”

Metal Coatings including:

Cr, Ti, Au, Al, Pt, Mo, W, Ni, Cu, Ir, Ta

PVD Sputtering

or

Evaporation

20-1000

From 1’’ to 6’’

(depending on metals)

Other metal coatings & multi-layer deposition also available

 

Dicing Services

 

Form

Specifications

Tiles

E.g. 10mm x 10mm, 20mm x 20mm (minimum size 1.5mm x 1.5mm)

 

PI-KEM Ltd is Distributor for Virginia Semiconductor, Inc. a specialist producer of prime silicon wafers 

PI-KEM ONLINE STORE © 2018 Company Number: 04215228 | VAT:GB 572885985

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