Target Bonding

We provide a Target Bonding service for when your application requires your sputtering target to be bonded to a strong compatible backing plate.

We also supply Backing Plates for this process.

The reliability of the bond between a sputtering target and backing plate is essential to ensure optimised performance.

Call us on +44 (0) 1827 259250 or contact us using the 'Request Quote' button above to fully discuss your target bonding requirements with one of our Technical Sales Executives.

Benefits

• Avoids damage to targets through inadequate cooling
• Prolongs working life of target over a non-bonded target
• Potential to achieve faster sputtering rates when using high power input
• Consistently repeat thin film process parameters

Bonding Options

Indium

• Has the best thermal conductivity of all available bonds
• Most materials can be indium bonded but there are a few exceptions

Elastomer

• Has higher temperature capability over indium bond.
• Recommended when customers consistently melt indium bonds.
• Idea for low melting point target materials, temperature sensitive compounds, low density or fragile targets
• Does not absorb any moisture and is more than suitable to handle cycles between vacuum and atmosphere.

Epoxy

• Economical, depending on application
• Thermal and electrical conductivity

Backing Plate Materials

• Copper
• Molybdenum

Forms

• Discs
• Plates
• Customer drawings

Service

• Backing Plate refurbishment
• Sputtering target stocking programs for quick turnaround on rebounded targets*

*By prior arrangement

Contact us to discuss your Target Bonding and Backing Plate requirements