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Target Bonding

We provide a Target Bonding service for when your application requires your sputtering target to be bonded to a strong compatible backing plate.

We also supply Backing Plates for this process.

The reliability of the bond between a sputtering target and backing plate is essential to ensure optimised performance.

 

 

 

Benefits

  • Avoids damage to targets through inadequate cooling
  • Prolongs working life of target over a non-bonded target
  • Potential to achieve faster sputtering rates when using high power input
  • Consistently repeat thin film process parameters

Bonding Options

Indium

  • Has the best thermal conductivity of all available bonds
  • Most materials can be indium bonded but there are a few exceptions

Elastomer

  • Has higher temperature capability over indium bond.
  • Recommended when customers consistently melt indium bonds.
  • Idea for low melting point target materials, temperature sensitive compounds, low density or fragile targets
  • Does not absorb any moisture and is more than suitable to handle cycles between vacuum and atmosphere.

Epoxy

  • Economical, depending on application
  • Thermal and electrical conductivity

 

Backing Plate Materials

  • Copper
  • Molybdenum

 

Forms

  • Discs
  • Plates
  • Customer drawings

 

Service

  • Backing Plate refurbishment
  • Sputtering target stocking programs for quick turnaround on rebounded targets*

*By prior arrangement

Contact us to discuss your Target Bonding and Backing Plate requirements

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