Researchers Are Choosing Our Platinised Wafers - Here’s Why.
Platinised Silicon Wafers: A Proven Substrate Platform for Advanced Device Research
Across ferroelectrics, thin-film research, MEMS, and sensor development, demand for platinised silicon wafers continues to grow. At PI-KEM, we are seeing increasing interest from research groups seeking substrates that can reliably support complex fabrication processes while delivering consistent, reproducible results.
Platinised silicon wafers have proven themselves as a dependable solution for applications, combining well-established materials with carefully controlled deposition processes to meet the needs of advanced research environments.
Combining Proven Materials for Reliable Performance
At their core, platinised silicon wafers bring together two materials that are already deeply embedded in semiconductor and materials research.
Silicon provides the mechanical stability, thermal compatibility, and familiar processing behaviour that researchers rely on. Platinum, deposited as a precisely engineered thin film, introduces excellent electrical conductivity, resistance to oxidation and corrosion, valuable catalytic properties, and the ability to withstand high-temperature processing.
This combination makes Pt/Si wafers particularly well suited to applications involving repeated annealing cycles, aggressive chemical exposure, or high-performance electrode structures. At PI-KEM, we focus on delivering wafers that maintain this reliability across a wide range of processing conditions, helping researchers minimise variability and focus on device performance.
Substrate Quality and Thin-Film Consistency
For many projects, inconsistency in thin-film behaviour can often be traced back to substrate limitations. Platinised silicon wafers are designed to address this by offering a controlled, reproducible surface for film growth and device fabrication.
A typical wafer begins with a high-quality boron-doped silicon substrate, though PI-KEM customers can specify preferred wafer parameters or supply their own substrates where required. Electrical isolation is achieved using a 0.5 µm thermal silicon dioxide or silicon nitride layer, followed by an adhesion layer such as SiO₂, TiO₂, or titanium. The platinum layer is deposited using electron-beam evaporation, with standard thicknesses around 150 nm and options down to 20 nm for more specialised requirements.
The resulting platinum surface exhibits a predominantly (111) crystallographic texture with minor (100) components. This well-defined structure supports consistent thin-film growth, enabling more reliable electrical behaviour and smoother progression from early prototypes to publishable results.
Customisation to Match Research Needs
One of PI-KEM’s strengths lies in our ability to tailor platinised silicon wafers to specific research requirements. Rather than offering a one-size-fits-all solution, we work closely with researchers to ensure the substrate aligns with their device architecture and processing constraints.
Platinum electrodes can be supplied as global films or patterned features, and configured as top electrodes, bottom electrodes, or both. Double-side-polished wafers may be coated on one or both sides, supporting more complex device designs. Chrome/gold interconnects can also be integrated directly with the platinum electrodes, simplifying wiring and downstream device integration.
This flexibility allows our wafers to support everything from exploratory materials research to more advanced, application-driven device development.
Supporting a Wide Range of Applications
The versatility of platinised silicon wafers is reflected in the breadth of applications we support at PI-KEM:
- Ferroelectric devices, where platinum provides a stable bottom electrode capable of withstanding high-temperature processing for memory devices, actuators, and sensors.
- Electrochemical sensors, which benefit from platinum’s conductivity and corrosion resistance for reproducible measurements in harsh chemical environments.
- MEMS technologies, where robust, conductive, and corrosion-resistant substrates are essential for electrodes, interconnects, and functional thin films.
- Surface chemistry and thin-film research, where high-quality platinum surfaces support catalytic studies, surface functionalisation, and consistent film growth under oxidising or high-temperature conditions such as rapid thermal annealing and sol-gel deposition.
Why Researchers Choose PI-KEM
PI-KEM specialises in supplying advanced materials to the research and development community. Our approach goes beyond simply providing the materials – we work closely with researchers to ensure each specification aligns with their processing conditions and device goals.
We also understand the practicalities of research procurement, particularly in academic environments. PI-KEM offers:
- Low minimum order quantities
- Flexible invoicing options
- Direct access to technical guidance during wafer selection to help avoid unnecessary delays
This combination of technical depth and practical support helps research groups move efficiently from concept to results.
Moving Forward
As research challenges continue to evolve, the importance of selecting the right substrate is increasingly central. Platinised silicon wafers offer a proven, adaptable platform that supports reliable thin-film growth, robust electrode performance, and complex device architectures.
For more detailed technical specifications, our silicon wafer product page provides a deeper technical overview. To discuss your product requirements, get in touch with our technical experts today.
📞 Call us on 01827 259250
📧 Email sales@pi-kem.co.uk
